12 - 16 April 2026
Strasbourg, France
Conference 14100 > Paper 14100-77
Paper 14100-77

Integrated silicon carbide photonics for color center-based quantum technology and classical applications

On demand | Presented live 14 April 2026

Abstract

Silicon carbide (SiC) is a prominent wide bandgap semiconductor for power electronics applications, due to its high breakthrough field strength, high thermal conductivity and low capacity. In recent years SiC has also emerged as a very promising candidate for integrated (quantum) photonics. This is because this wide bandgap material has many strengths, including being a mature technology platform, CMOS and bio-compatible, non-toxic and has unique photonic properties, such as high second-order and third-order nonlinearities, a high refractive index, a low intrinsic optical loss material that can host versatile color centers. However, despite these good material properties, three substantial challenges have to be addressed: a) the fabrication of SiC-on-Insulator (SiCOI) stacks for light confinement; b) the development of device fabrication technology with SiCOI for integrated (quantum-) photonic circuits; c) Low loss and dispersion control as well as efficient coupling scheme for coupling light in and out of a chip by a dedicated (nano-)fabrication technology and material engineering.

Presenter

Martin Hofmann
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB (Germany)
Dr. Martin Hofmann is Post-Doc at Fraunhofer Institute for Integrated Systems and Device Technology. He is working on establishing a silicon carbide platform for integrated photonic and quantum technology applications. He brings along a background in nanofabrication and characterization of semiconductors and focusses prominently on the development of Silicon carbide-on-Insulator substrates from chip scale to wafer sizes and the applicability of these substrates in a CMOS-compatible cleanroom.
Presenter/Author
Martin Hofmann
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB (Germany)
Author
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB (Germany)
Author
Friedrich-Alexander-Univ. Erlangen-Nürnberg (Germany), Max-Planck-Institut für die Physik des Lichts (Germany)
Author
Fabian Magerl
Friedrich-Alexander-Univ. Erlangen-Nürnberg (Germany)
Author
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB (Germany), Friedrich-Alexander-Univ. Erlangen-Nürnberg (Germany)
Author
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB (Germany)
Author
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB (Germany)
Author
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB (Germany)
Author
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB (Germany)
Author
Eberhard Bär
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB (Germany)
Author
Pascal Del’Haye
Max-Planck-Institut für die Physik des Lichts (Germany), Friedrich-Alexander-Univ. Erlangen-Nürnberg (Germany)
Author
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB (Germany), Friedrich-Alexander-Univ. Erlangen-Nürnberg (Germany)