Standardized process design kit for a heterogeneous electronic-photonic system in a glass package (Invited Paper)

Scalable test, assembly, and packaging processes are being developed to support dense electronic-photonic integration in high-volume production flows. Electronic, photonic, and micro-optic components have to be combined in a small form factor on a common substrate, fulfill demanding performance and cost expectations from the application perspective, while supporting efficient scaling for volume production environments. Test flows, processes, and tools for validation of parts, subsequent assembly steps, and functional verification of the final packages are being established. Convergence with existing semiconductor standards and the enablement of efficient design are essential for a wide adoption of such heterogeneous technologies. A design flow featuring a heterogeneous process design kit has been created for the JEDEC-compliant, glass-based electronic-photonic packaging technology developed in the PhotonicLEAP project, and will be demonstrated. The PhotonicLEAP process design kit enables a seamless design process while capturing front-end process from multiple sources, along with back-end (assembly and packaging) and test.