Non-invasive trimming of photonic integrated circuits via FIB deposition

Photonic integrated circuits (PICs) are widely used in optical communications and photonic computing. As the number of integrated components increases, the accumulation of fabrication-induced deviations degrades PIC performance, necessitating reliable post-fabrication trimming techniques. In this work, we introduce a non-invasive trimming method based on focused ion beam (FIB) deposition, enabling highly localized, room-temperature tuning of photonic components with minimal optical loss. We demonstrate its applicability to representative device structures and evaluate their optical response. This approach provides a practical and broadly compatible tool for enhancing the performance and scalability of next-generation PIC systems.