Paper 14093-60
Paper 14093-60
Customised through vias in glass interposer production using ultrafast lasers and chemical etching
15 April 2026 • 17:00 - 17:15 CEST | Curie A (Niveau/Level 1)
Abstract
Glass interposers are becoming popular for advanced electronics packaging, especially in low-volume, high-value applications. They help connect different types of chips on a shared platform, offering strong performance without needing complex single-chip designs. This work explores the creation of through vias in Schott Borofloat33 glass using selective laser etching. By adjusting the laser processing and chemical post-processing parameters, we achieved control over hole size, shape, and spacing. Our approach allows for tightly packed, high-quality interposers with high aspect ratio holes which will support flexible, cost-effective manufacturing for next-generation electronics.
Presenter
Toby Barnard
Oxford Lasers Ltd. (United Kingdom)
Toby Barnard is a Laser Applications and Systems Development Engineer at Oxford Lasers. He completed his PhD in Ultrafast X-ray Spectroscopy at Imperial College London in 2021 and joined the R&D department at Oxford Lasers in 2023. Toby specialises in developing novel approaches to laser micromachining challenges, with a particular focus on pre- and post-processing of samples. He is also exploring the application of machine learning techniques to improve process understanding and control in laser systems.