Paper 14110-25
Paper 14110-25
Resist profile aware SMO for EUV lithography
16 April 2026 • 12:30 - 12:50 CEST | Madrid 1/Salon 3 (Niveau/Level 0)
Abstract
Advanced semiconductor manufacturing requires ever small features on the wafer. In recent years, extreme ultraviolet (EUV) lithography has become one of the critical technologies that enables this scaling. Its small wavelength (13.5nm) allows to print features down to 13nm (0.33NA) and recently down to 8nm (0.55NA). However, the trade-off between contrast and DoF also becomes critical. In this work, we present several possible SMO solutions to control the resist profile.
Presenter
Shih-Hsiang Liu
ASML Netherlands B.V. (Netherlands)
Shih-Hsiang Liu received his MSc degree from National Taiwan University in Electrical Engineering and an EngD in Applied Physics from Eindhoven University of Technology. He joined ASML Netherlands in 2018. He is currently a Lead Engineer in the EUV imaging group working on resolution enhancement techniques.