Space-qualified infrared image sensor for space application

All electrical, electronic, and electromechanical (EEE) components shall be verified in accordance with the relevant test standards prior to being implemented in the space application. This paper describes the evaluation testing items and its results for the InfraRed Focal Plane Array (IRFPA) and Detector Dewar Assembly (DDA) developed for space program. As a special in-process control test for all kinds of materials used for manufacturing, a variety of process tests were performed and shown its performance uniformity in each requirement. In order to reduce the infant failure in the beginning of IRFPA manufacturing, all lot of wafer were subjected to lot acceptance testing (LAT) and screening testing. For LAT, high-resolution transmission electron Microscopy (HRTEM), X-ray diffraction (XRD), and Photoluminescene (PL) test were performed and the results confirmed that both EPI and ROIC wafers are met the required specifications. And Total Ionized Dose (TID) test results also shown that the IRFPA was sustained its performance of noise equivalent temperature difference (NETD) and quantum efficiency (QE) during irradiation. After cryogenic test for screening, it shows no anomalies in physical structure and electrical connections. To verify the suitability of the DDA includes IRFPA in the space environment, the environmental testing was performed. Vibration, Shock and Thermal Cycling tests were performed as part of the launch and on-orbit environment testing and radiation test such as displacement damage and single event effect test were also performed in order to verify the radiation hardness of the IRFPA. All of the test results confirmed the suitability of IRFPA and DDA for space environment.