Paper 14037-38
Event-driven ROICs optimized for high sensitivity and event throughput at MWIR
29 April 2026 • 11:00 AM - 11:20 AM EDT | National Harbor 10
Abstract
This work presents advances in readout integrated circuit (ROIC) design for event-based infrared (IR) imagers, focusing on pixel- and array-level innovations that enhance sensitivity, throughput, power efficiency, and uniformity. Two generations of 32×32-pixel arrays are demonstrated. The first integrates a classical logarithmic pixel (LOG-NCG) and a new linear-response pixel (LIN-TIA) optimized for high-background operation, achieving >90 dB dynamic range, <1.8 K minimum event temperature (MET), and <10 µs latency. The LIN-TIA enables tunable contrast sensitivity down to 1.82% (~500 mK MET) with stable background response. Simulation results for the second-generation array, which incorporates a photovoltaic change-detector (PVCD) pixel, show MET below 300 mK while reducing pixel power to ~50 µW. New change-detector amplification and non-uniformity correction schemes improve contrast threshold uniformity (CTNU) and sensitivity. Implemented in 0.18 µm CMOS with 30 µm pitch, these architectures provide a scalable, low-power foundation for next-generation event-based IR imaging systems.
Presenter
Roman Fragasse
SenseICs (United States)
Roman Fragasse is a Senior Design Engineer at SenseICs Corporation. He earned his B.S., M.S., and Ph.D. degrees from Ohio State University, in Electrical and Computer Engineering in 2016, 2018, and 2025, respectively. His past research focused on high-speed SRAM sensing techniques, while his current work involves mixed-signal design for high-performance CMOS image sensors and readout integrated circuits (ROICs) for passive EO/IR and LiDAR receivers and event-driven image sensors. At SenseICs, he has led projects ranging from medium-format MWIR ROICs to LiDAR receiver front-ends for NASA ESTO atmospheric profiling instruments. Roman has authored or co-authored 13 journal and conference papers.