An improved version of the aplanoXX_NA0.8 objective supplied with protective window for diffraction limited focusing with NA up to 0.8 inside transparent materials with compensation for spherical aberration at depths ranging from 0 to 4 mm. Optics is optimized for operation with high power ultra-short pulse lasers with wavelengths of 515 nm, 800 nm, 1030 nm. The patented optical design is optimized for microprocessing fused silica, sapphire, glass, SiC, silicon and other materials in applications, such as, dicing in the manufacture of LED, Selective Laser Etching, nanostructuring for optical data storage and recording of polarization converters, 3D micro- and nanofabrication. The aberration-free high NA focusing is also important in various types of microscopy. In response to practice requests, the aplanoXX_NA0.8 objectives are equipped with a replaceable protective window that prevents damage of optical elements from chips and dust ejected during material processing. The aplanatic optical design guarantees low sensitivity to misalignments, which facilitates and simplifies the integration of aplanoXX objectives in existing equipment and research setups.
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