G&H Group

G&H (Gooch & Housego) (LON: GHH), a global specialist in photonic components and subsystems, has played a key manufacturing role in the innovative solid-state laser technology recently recognized by the Institute of Physics with a Business Innovation Award for Thales. The award celebrates a next-generation diode-pumped solid-state laser optimized for high-performance laser rangefinders (LRFs), delivering extended range, improved reliability, and reduced size, weight, power, and cost (SWaP-C). The technology is now deployed across major UK defense platforms, including Boxer and the Challenger 3. Manufacturing Innovation Meets Defense-Grade Performance At the heart of the innovation is the application of telecoms-style manufacturing techniques to defense laser systems - an approach that enables unprecedented compactness, lifetime, and reliability while meeting the extreme environmental demands of military service. “This programme demonstrates how telecoms-grade photonic manufacturing can be successfully applied to defense laser systems with extreme performance and lifetime requirements. Working closely with Thales, we translated an advanced laser design into a compact, hermetically packaged transmitter capable of long-term operation in harsh environments and at production scale,” said Dr. Stratos Kehayas, President, Photonics at G&H. G&H collaborated with Thales to manufacture the laser transmitter to a patented design, drawing on decades of experience in high-reliability photonic packaging, precision alignment, hermetic sealing, and volume manufacturing methods originally developed for the global telecoms industry. This manufacturing approach enables: Exceptional reliability and lifetime suitable for platforms with service lives exceeding 20 years Compact, rugged laser transmitters capable of long-range, eye-safe operation Scalable production aligned with growing defense deployment volumes From Research Funding to In-Service Systems Initial development of the laser technology was supported by Innovate UK funding in 2015. Since then, the design has transitioned from technology demonstrators to in-service systems forming a core part of Thales’ laser rangefinder and sensor product lines. The collaboration is also documented in peer-reviewed research, including the openly published paper Compact, diode-pumped, solid-state lasers for next generation defense and security sensors (Journal of Physics: Conference Series), which details the technical foundations of the laser rangefinder and target designator architectures. Enabling the Next Generation of Defense Sensors The resulting laser transmitters deliver kilometer-scale ranging performance from compact, eye-safe solid-state sources, while operating across extreme temperature ranges and under high shock and vibration. By combining advanced laser design with telecoms-derived manufacturing discipline, the collaboration sets a new benchmark for defense photonics reliability and scalability. For G&H, the programme highlights the company’s role as a trusted manufacturing partner for complex, mission-critical photonic subsystems - bridging the gap between innovative laser designs and deployment-ready hardware for defense and security applications.

G&H (LON: GHH), hermetic photonics packaging supports mission-critical systems in the harshest conditions. It’s not uncommon to find photonics in the most inhospitable and challenging environments. As part of the subsea telecommunications network, photonics technology keeps the world connected deep under the ocean. It operates in freezing terrain, where vital pipelines supply energy to power our cities. In the desert, it may be used as part of the imaging system of an armored fighting vehicle, whose crew must make split-second decisions. That's just here on earth - in space, photonics is increasingly utilized in navigation, remote sensing and space communications, as well as scientific exploration missions. Whether in low Earth orbit (LEO) or in the outer solar system, the environmental challenges reach another level of extreme in space. Maintaining the peak performance and reliability of technology in harsh environments is a commercial imperative. Repair or replacement is either costly or impractical. Therefore, hermetic sealing or hermetic packaging is an essential element in the overall design of effective photonics solutions for challenging environments. Why harsh-environment photonics needs hermetic packaging Hermetic packaging is widely used across industries to create airtight or watertight seals for sensitive technology. In photonics, the challenge is more complex: you often need to protect optoelectronics and precision optics from the environment while still enabling optical transmission, fiber routing, and sometimes RF/electrical connectivity. As a starting point, there are five hazards to consider when designing photonics for extreme environments. 1) Temperature: wide operating ranges and thermal cycling Industrial equipment is often designed around typical operating ranges (commonly cited as -40 to 85°C), but harsh environments can stretch well beyond that, whether it’s freezing conditions, desert heat, or rapid transitions between extremes. Space adds another dimension. Depending on thermal design, orbit and exposure, hardware may experience severe thermal gradients and repeated cycling over long periods. These temperature stresses can impact alignment stability, material interfaces, seal integrity and component ageing. How hermetic packaging helps: A well-designed hermetic package supports stability by controlling internal conditions and protecting sensitive interfaces from external thermal and environmental influences. Material selection, mechanical design, and joining methods all matter when the goal is long-life performance across repeated thermal cycles. 2) Moisture: corrosion, fogging, and long-term degradation Moisture can be a slow-acting failure mechanism, particularly where salt fog, tropical humidity, condensation or freeze-thaw cycles are involved. Even tiny levels of water vapor in an enclosure can degrade optoelectronic performance over time, encourage corrosion, and reduce operational life. How hermetic packaging helps: Hermetic sealing significantly reduces ingress risk, provided the internal environment is properly prepared. Total removal of moisture and water vapor prior to sealing is essential, and verification testing is a key part of any robust packaging approach. 3) Radiation: performance degradation in space Radiation is a major consideration for space photonics. Different orbits expose hardware to varying mixes of electrons, protons and heavier ions. Radiation effects can degrade optoelectronic components and materials, ultimately affecting signal quality, stability and lifetime. How hermetic packaging helps: While hermetic sealing isn’t a “radiation shield” on its own, robust packaging practices reduce secondary risks such as contamination, moisture-driven degradation and outgassing deposits, helping maintain stable operation for sensitive photonics assemblies in space-grade environments. 4) Gases and outgassing: contamination from unexpected sources Hermetic packaging isn’t only about keeping outside air out. Over time, unwanted gases can be generated inside a sealed enclosure from trace organics in adhesives, lubricants, sealants, labels, or residues left from handling and assembly. In optical systems, even minor contamination can affect performance. In space particularly, low outgassing is critical to prevent contamination of instrumentation and optical surfaces. How hermetic packaging helps: Hermetic packages can be designed and built with process controls that minimize organic content and manage internal atmosphere. This helps protect optical surfaces, maintain stable device behavior, and reduce contamination risk over long deployments. 5) Physical stress: shock, vibration, pressure and handling loads Harsh environments often include shock and vibration (launch, transport, vehicle operation), pressure (subsea), and rugged handling conditions. These can disrupt alignment, compromise seals, fatigue joints, and damage delicate internal structures. How hermetic packaging helps: Hermetic packaging for harsh conditions is typically ruggedized -designed to be hardwearing and shock-resistant, so the package supports both environmental protection and mechanical survivability. Best practice in photonics hermetic packaging Overcoming these challenges requires sophisticated processes, tight control, and verification at each stage. Drawing on G&H’s long-standing experience collaborating with customers to develop robust solutions for defense, space and industrial applications, here are practical best-practice methods that help optimize hermetic, ruggedized packaging: Controlled internal atmosphere: sealing optoelectronic chips in a precisely controlled mixture of gases to minimize ageing and degradation Robust materials and ultra-low leak rates: selecting strong package materials and finishes where needed, with extremely low leak rates Minimized organic contamination: using approaches such as laser marking/etching for identification to reduce organic material sources Connector and feedthrough integrity checks: methods such as inverted leak checks on RF connectors and fiber tubes to confirm sealing performance Moisture removal protocols: extensive vacuum bake (vac bake) and related process steps to reduce residual moisture, including the use of getters where appropriate Pre-seal verification: lid condition dry air tests and other checks prior to final seal Environmental validation: dew point testing at temperature extremes to measure response to external moisture Seal robustness testing: seam seal resistance weld tests to demonstrate package strength Leak testing: gross and fine leak checks to verify hermetic performance Packaging isn’t an afterthought - it’s a performance enabler In harsh environments, hermetic packaging can be the difference between reliable operation and premature failure. It protects sensitive photonics, maintains stability over time, and supports operation in conditions where repair or replacement is either prohibitively expensive or impossible. As photonics moves into more demanding applications, from subsea networks and rugged defense platforms to next-generation space missions, how well the technology performs at extremes may become a defining attribute. Talk to G&H if you’re designing photonics for harsh environments and need guidance on hermetic packaging, ruggedization, and reliability-focused manufacturing practices.

Gooch & Housego (G&H) (LON: GHH), a global designer and manufacturer of advanced photonic materials, components, and systems, today announced its role in establishing a new domestic manufacturing capability for thin-film lithium niobate (TFLN) wafers, a critical material underpinning next-generation photonic technologies for defense and commercial applications. The initiative is being executed in collaboration with Raytheon, an RTX business, following the award of a U.S. Air Force Research Laboratory contract to develop a secure, U.S.-based TFLN supply chain. G&H’s Cleveland, Ohio facility will serve as the domestic production site for TFLN wafers as the program transitions from process development into low-rate initial production. Thin-film lithium niobate is a foundational material for high-speed, low-loss photonic systems used in secure communications, sensing, and signal processing. Demand for TFLN is rapidly increasing across defense, aerospace, telecommunications, data centers, and emerging computing architectures, while global supply remains highly concentrated outside the United States. “Establishing U.S.-based production of thin-film lithium niobate is a strategic step for strengthening domestic photonics capability,” said Dr. Stratos Kehayas, President of the Photonics Division at G&H. “G&H’s vertically integrated crystal growth, wafer processing, and manufacturing expertise enables the reliable transition of advanced photonic materials from laboratory development into scalable, production-ready supply - supporting both national security and commercial innovation.” Under the collaboration, Raytheon’s Advanced Technology team is developing the ion-slicing process required to produce high-quality TFLN wafers. Once the process is established, G&H will manufacture the wafers in Cleveland, leveraging its U.S.-based infrastructure, quality systems, and experience supporting regulated defense and aerospace programs. Raytheon will continue to work closely with G&H to support technology transfer, qualification, and production readiness. Initial domestic production is expected to begin in early 2026, with capacity expansion planned to support broader defense industrial base and commercial market demand. About Gooch & Housego (G&H) G&H is a global designer and manufacturer of advanced photonic materials, components, and systems serving aerospace and defense, industrial, telecom, and life sciences markets. With vertically integrated capabilities spanning crystal growth, precision wafer processing, optical fabrication, and regulated manufacturing, G&H supports customers from early-stage development through full-rate production and long-term lifecycle management. The company maintains established U.S. manufacturing operations that enable secure, domestic supply of critical photonic technologies. About Raytheon Raytheon, an RTX business, is a leading provider of defense solutions to help the U.S. government, our allies and partners defend their national sovereignty and ensure their security. For more than 100 years, Raytheon has developed new technologies and enhanced existing capabilities in integrated air and missile defense, smart weapons, missiles, advanced sensors and radars, interceptors, space-based systems, hypersonics and missile defense across land, air, sea and space. About RTX With more than 180,000 global employees, we push the limits of technology and science to redefine how we connect and protect our world. With industry-leading capabilities, we advance aviation, engineer integrated defense systems for operational success, and develop next-generation technology solutions and manufacturing to help global customers address their most critical challenges. The company, with 2025 sales of more than $88 billion, is headquartered in Arlington, Virginia.

G&H (LON:GHH), a global leader in precision optics and photonics technology, is proud to be featured in Military Systems & Technology magazine, March edition. Guidance, navigation, and control (GNC) systems rely on accurate measurement of position, orientation, and motion, yet today’s contested environments have pushed inertial sensing from a backup to a core capability. G&H (Gooch and Housego) supports this shift by designing and manufacturing defence-grade ring laser gyroscope (RLG) components engineered for the demanding conditions missiles and UAVs face, where performance margins are tight and failure is unacceptable. By enabling accurate autonomous navigation without dependence on external signals, G&H’s RLG technology helps system designers maintain survivability, targeting accuracy, and mission success as platform autonomy and mission duration increase. Why G&H’s RLG components matter in harsh environments Ring laser gyroscopes deliver rotation sensing via optical interference within a closed laser cavity, with no moving parts to wear, supporting long operational life and consistent performance under shock, vibration, and wide temperature excursions. This is why RLGs remain widely deployed across aerospace and defence platforms, including missiles and UAVs, where guidance accuracy must be preserved through aggressive manoeuvres and punishing environmental loads. G&H designs and manufactures RLG components specifically for these harsh operating regimes, helping inertial navigation solutions achieve superior bias stability and ultra-low drift when accuracy must be sustained over extended periods without external correction. By tightly controlling the quality of the optical path, supported by precision finishing, advanced coatings, and rigorous inspection, G&H helps inertial system integrators maintain repeatable performance across production builds and throughout long programme lifecycles, reducing the risk of variation that can erode navigation confidence. GPS-denied reality and the role of high-stability inertial sensing In modern conflict environments, GPS jamming and spoofing have turned degradation into a planning assumption, and even non-combat scenarios, dense urban terrain, mountains, or electromagnetic interference, can disrupt satellite signals. In these conditions, navigation performance becomes a function of inertial sensor stability: all inertial systems drift over time, but the rate of error growth differs dramatically by technology and directly affects mission duration, targeting precision, and confidence in guidance outcomes. G&H’s RLG-based approach sits at the high-performance end of inertial sensing, supporting applications where designers prioritise stability and reliability over lower-cost alternatives. For high-value UAV missions, longer flight times and complex routes increase the consequences of drift, making low-bias, high-stability gyroscopic performance critical, especially when external updates are unavailable or intermittent. By enabling more predictable navigation behaviour over time, G&H’s RLG technology helps platforms maintain guidance integrity and operational effectiveness in denied, degraded, and contested environments. G&H engineering assurance RLG performance depends on a tightly controlled interaction of multiple specialised components - mechanical stability, optical quality, and environmental resilience must be engineered as a unified system. G&H’s vertically integrated model strengthens subsystem assurance by designing and manufacturing the complete RLG component package, including the RLG frame and critical optical elements, maintaining control over material selection, process parameters, and quality assurance to reduce sourcing complexity and mitigate supply-chain risk. The RLG frame’s geometric stability is supported by near-zero thermal expansion materials such as Zerodur®, while optical elements (mirrors, beam splitters, prisms, wedges) require ultra-low loss, enabled by superpolishing (better than 1 Å RMS) and high-reflectivity, low-loss IBS coatings to sustain performance through shock, vibration and thermal cycling. Extensive in-house metrology and environmental qualification verify optical surface quality and tolerances at sub-micron/sub-angstrom levels. All components are designed and manufactured at G&H’s Moorpark, California facility, operating under ISO9001 and AS9100 and ITAR compliance, supporting secure supply chains for U.S. and allied defence programmes. As GPS-denied conditions become the norm, inertial sensing performance is increasingly defined by long-term stability, environmental robustness, and manufacturing assurance. G&H’s defence-grade RLG components help enable reliable guidance for missiles and UAVs when mission success depends on assured navigation.

G&H (LON: GHH), a global leader in advanced photonics and optical solutions, will exhibit at SPIE Defense + Security 2026, taking place April 28–30 at the Gaylord Palms Resort & Convention Center in National Harbor, Maryland, USA. Visitors are invited to Booth #613 to explore G&H’s latest innovations in infrared imaging and optical communications, including the debut of its Garnet™ MWIR lens series and advancements in U.S.-based Thin-Film Lithium Niobate (TFLN) manufacturing. Introducing Garnet™: Germanium-Free MWIR Lens Assemblies for Supply-Resilient Imaging Systems At DCS 2026, G&H will introduce the Garnet™ MWIR lens assembly series, developed by G&H | StingRay. Built on the proven Ruby™ platform, Garnet eliminates the use of Germanium - an increasingly constrained infrared material - while maintaining the high-performance imaging required for defense and surveillance applications. No Chalcogenide materials are used in this lens series, making them supplier-agnostic, further strengthening supply chain resilience. Designed for operation across the 3–5 µm wavelength range, Garnet enables system designers to preserve optical performance while improving long-term supply chain resilience. Key features include: Germanium-free optical design Achromatic performance across 3–5 µm Compatibility with f/2.3, f/2.5, and f/4.0 systems Support for up to 21 mm image formats Manual focus with lock and standard IR bayonet mount The Garnet series is optimized for mission-critical applications, including intelligence, surveillance, and reconnaissance (ISR), border security, and target detection systems - where both performance and material availability are non-negotiable. Advancing U.S. Photonics Capability with Thin-Film Lithium Niobate (TFLN) G&H will also highlight its expanding role in establishing a secure, U.S.-based supply chain for Thin-Film Lithium Niobate (TFLN), a foundational material for next-generation photonic systems. Through collaboration with Raytheon and the U.S. Air Force Research Laboratory, G&H is supporting the transition of TFLN from process development into scalable domestic production at its Cleveland, Ohio facility. TFLN is increasingly critical for high-speed, low-loss optical systems used in: Secure communications Advanced sensing and signal processing Photonic integrated circuits (PICs) Next-generation data and defense infrastructure “Establishing U.S.-based production of thin-film lithium niobate is a strategic step toward strengthening domestic photonics capability,” said Dr. Stratos Kehayas, President of the Photonics Division at G&H. “G&H’s vertically integrated crystal growth, wafer processing, and manufacturing expertise enables the reliable transition of advanced photonic materials from laboratory development into scalable, production-ready supply - supporting both national security and commercial innovation.” Initial production is expected in early 2026, with planned capacity expansion to meet growing demand across defense, aerospace, and communications markets. From Materials to Systems: Enabling Next-Generation Defense Technologies G&H’s showcase reflects its vertically integrated approach - from crystal growth and wafer processing to optical components and fully assembled systems - supporting high-reliability applications across aerospace and defense. By combining supply-chain-resilient materials, advanced optical design, and U.S.-based manufacturing, G&H enables customers to deploy next-generation sensing and communication technologies with confidence. Thermosense Vendor Session Presentation G&H will also participate in the Thermosense Vendor Session, offering early insight into its latest infrared imaging capabilities: Through the Lens: Unlocking G&H | StingRay’s Optical Power Presenter: Zachary French, Application Engineer, G&H 27 April 2026 | 1:00 PM - 5:00 PM EDT, National Harbor 12, Maryland, US This session provides attendees with a preview of G&H’s latest MWIR and SWIR innovations, helping them prioritize technologies and exhibitors ahead of the show floor opening. Visit G&H at Booth #613 Meet the team at SPIE Defense + Security 2026 to explore how G&H is advancing infrared imaging, optical communications, and photonic materials for defense and high-reliability applications.