Modular thermo-mechanical framework for agile prototyping of space instruments: the DUSTER case

The paper describes the thermo-mechanical framework developed for the DUSTER breadboard, aimed at integrating EMI-sensitive, high-voltage electronics in a configuration that remains practical for assembly and test. The enclosure is built from stacked aluminium frames supporting the DPU, the low- and high-voltage power supplies, and the sensor front-ends. Connector distribution was arranged to limit cable cross-routing and to keep kilovolt-level bias lines away from low-level analog paths. EMC control relies on conductive gaskets at the critical interfaces, while the thermal design follows a staged approach based on board-level conduction, internal heat links, and external baseplate coupling. This made it possible to introduce thermal improvements during laboratory testing without redesigning the enclosure.